Guía de máquinas SPI: Explicación de la inspección de pasta de soldadura
An SPI machine inspects solder paste after printing and before placement. A 3D system typically measures deposit height, area, volume and offset. Its value is early process control: defects can be found before components and reflow make correction more expensive.
# SPI Machine Guide: Solder Paste Inspection Explained
An SPI machine inspects solder paste after printing and before placement. A 3D system typically measures deposit height, area, volume and offset. Its value is early process control: defects can be found before components and reflow make correction more expensive.
Measurements and Meaning
| Measurement | Evidence provided |
|---|---|
| Altura | Incomplete or excessive deposit |
| Área | Smear, bridge or poor release |
| Volume | Combined transfer result |
| X/Y offset | Alignment or board/stencil variation |
| Shape | Irregular release or contamination |
JUKI describes SPI as measuring area, height, quantity and misalignment with multi-direction lighting and 3D sensing. See JUKI process overview.
Limits Need Process Evidence
Pad geometry, aperture, paste and package risk affect what is acceptable. Establish a stable print, correlate measurements with post-reflow results, define critical features, review false calls and escapes, and control program changes.
SPI can send corrections or cleaning actions to a printer and offset information to placement on supported lines. JUKI provides examples at automation solutions. Safeguards are required so a bad reference does not cause repeated wrong correction.
Selection Checklist
Compare measurable feature size, board range, repeatability, coverage, cycle time, programming, review workflow, traceability, data export and printer/mounter interfaces. Challenge the system with representative boards and known defects.
Preguntas frecuentes
Does SPI replace AOI?
No. SPI evaluates paste before placement; AOI evaluates visible component and solder features later.
Is volume the only useful metric?
No. Height, area, offset, shape and trends help explain causes and risks.
Fuentes primarias
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