{"id":862,"date":"2026-02-19T09:00:00","date_gmt":"2026-02-19T01:00:00","guid":{"rendered":"https:\/\/smtbase.com\/spi-machine-guide\/"},"modified":"2026-08-23T22:25:39","modified_gmt":"2026-08-23T14:25:39","slug":"huong-dan-su-dung-may-spi","status":"publish","type":"page","link":"https:\/\/www.smtbase.com\/vi\/tai-nguyen\/huong-dan-su-dung-may-spi\/","title":{"rendered":"H\u01b0\u1edbng d\u1eabn v\u1ec1 m\u00e1y SPI: Gi\u1ea3i th\u00edch v\u1ec1 quy tr\u00ecnh ki\u1ec3m tra b\u1ed9t h\u00e0n"},"content":{"rendered":"\n<style>\n:root{--navy:#07182e;--blue:#1468e5;--orange:#f47a32;--ink:#17263a;--line:#dfe7f1;--mist:#f4f7fb}*{box-sizing:border-box}html{scroll-behavior:smooth}body{margin:0;color:var(--ink);font-family:Inter,\"Segoe UI\",Arial,sans-serif;line-height:1.72}a{color:var(--blue);text-decoration:none}.shell{width:min(1180px,calc(100% - 40px));margin:auto}.preview{padding:10px;color:#ffe8d8;background:#6e2e0d;text-align:center;font-size:12px;font-weight:700}.hero{padding:92px 0 43px;border-bottom:1px solid var(--line)}.hero .shell{width:min(1180px,calc(100% - 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40px))!important;height:auto!important;margin:34px auto 0!important;overflow:visible!important;border:0!important;border-radius:0!important;background:#eef2f6!important;box-shadow:none!important}\n.smt-article-page .smt-detail-cover img{display:block!important;width:100%!important;height:420px!important;aspect-ratio:auto!important;object-fit:cover!important;object-position:center!important;border:0!important;border-radius:0!important;box-shadow:none!important}\n.smt-article-page .smt-detail-cover figcaption{margin:7px 0 0!important;color:#7b8795!important;background:#fff!important;font-size:10px!important;line-height:1.5!important;text-align:right!important}\n.smt-article-page .smt-detail-cover figcaption a{color:#60758d!important}\n@media(max-width:760px){.smt-article-page .smt-detail-cover{width:calc(100% - 28px)!important;height:auto!important;margin-top:24px!important}.smt-article-page .smt-detail-cover img{height:auto!important;aspect-ratio:3\/2!important}}\n<\/style><div class=\"smt-page-full alignfull smt-article-page\"><header class=\"hero\"><div class=\"shell\"><nav class=\"crumbs\"><a href=\"\/\">Home<\/a><span>\/<\/span><a href=\"\/resources\/\">Resources<\/a><span>\/<\/span><strong>SPI Machine Guide<\/strong><\/nav><h1>SPI Machine Guide: Solder Paste Inspection Explained<\/h1><p class=\"lead\">An SPI machine inspects solder paste after printing and before placement. A 3D system typically measures deposit height, area, volume and offset. Its value is early process control: defects can be found before components and reflow make correction more expensive.<\/p><div class=\"meta\"><span>By SMTBase Editorial Team<\/span><span>Fact checked: 2026-08-23<\/span><span>3 min read<\/span><\/div><div class=\"warning\">Editorial status: technical reviewer name and credentials still need to be added before publication.<\/div><\/div><\/header><figure class=\"smt-detail-cover\"><img fetchpriority=\"high\" src=\"https:\/\/smtbase.com\/wp-content\/uploads\/2026\/08\/resource-cover-spi-machine.webp\" alt=\"Yamaha YSi-SP 3D solder paste inspection machine\" width=\"1200\" height=\"800\" loading=\"eager\" decoding=\"async\"><figcaption>Image source: <a href=\"https:\/\/global.yamaha-motor.com\/business\/smt\/inspectionsystem\/ysi-sp\/\" target=\"_blank\" rel=\"noopener noreferrer\">Yamaha Motor<\/a><\/figcaption><\/figure><aside id=\"reader\"><span class=\"label\">Text size<\/span><button data-a=\"down\">A\u2212<\/button><button class=\"reset\" data-a=\"reset\">Reset<\/button><button data-a=\"up\">A+<\/button><span class=\"value\">100%<\/span><\/aside><main class=\"shell grid\"><aside class=\"toc\"><strong>In this guide<\/strong><nav><a href=\"#measurements-and-meaning\">Measurements and Meaning<\/a><a href=\"#limits-need-process-evidence\">Limits Need Process Evidence<\/a><a href=\"#selection-checklist\">Selection Checklist<\/a><a href=\"#faq\">FAQ<\/a><a href=\"#related-resources\">Related Resources<\/a><a href=\"#primary-sources\">Primary Sources<\/a><\/nav><\/aside><article class=\"article\"><p># SPI Machine Guide: Solder Paste Inspection Explained<\/p>\n<p>An SPI machine inspects solder paste after printing and before placement. A 3D system typically measures deposit height, area, volume and offset. Its value is early process control: defects can be found before components and reflow make correction more expensive.<\/p>\n<h2 id=\"measurements-and-meaning\">Measurements and Meaning<\/h2>\n<div class=\"table-scroll\"><table><thead><tr><th>Measurement<\/th><th>Evidence provided<\/th><\/tr><\/thead><tbody>\n<tr><td>Height<\/td><td>Incomplete or excessive deposit<\/td><\/tr>\n<tr><td>Area<\/td><td>Smear, bridge or poor release<\/td><\/tr>\n<tr><td>Volume<\/td><td>Combined transfer result<\/td><\/tr>\n<tr><td>X\/Y offset<\/td><td>Alignment or board\/stencil variation<\/td><\/tr>\n<tr><td>Shape<\/td><td>Irregular release or contamination<\/td><\/tr>\n<\/tbody><\/table><\/div>\n<p>JUKI describes SPI as measuring area, height, quantity and misalignment with multi-direction lighting and 3D sensing. See <a href=\"https:\/\/www.juki.co.jp\/en\/products\/smt.html\" target=\"_blank\" rel=\"noopener noreferrer\">JUKI process overview<\/a>.<\/p>\n<h2 id=\"limits-need-process-evidence\">Limits Need Process Evidence<\/h2>\n<p>Pad geometry, aperture, paste and package risk affect what is acceptable. Establish a stable print, correlate measurements with post-reflow results, define critical features, review false calls and escapes, and control program changes.<\/p>\n<p>SPI can send corrections or cleaning actions to a printer and offset information to placement on supported lines. JUKI provides examples at <a href=\"https:\/\/www.juki.co.jp\/smt\/en\/automatization\/\" target=\"_blank\" rel=\"noopener noreferrer\">automation solutions<\/a>. Safeguards are required so a bad reference does not cause repeated wrong correction.<\/p>\n<h2 id=\"selection-checklist\">Selection Checklist<\/h2>\n<p>Compare measurable feature size, board range, repeatability, coverage, cycle time, programming, review workflow, traceability, data export and printer\/mounter interfaces. Challenge the system with representative boards and known defects.<\/p>\n<h2 id=\"faq\">FAQ<\/h2>\n<h3 id=\"does-spi-replace-aoi\">Does SPI replace AOI?<\/h3>\n<p>No. SPI evaluates paste before placement; AOI evaluates visible component and solder features later.<\/p>\n<h3 id=\"is-volume-the-only-useful-metric\">Is volume the only useful metric?<\/h3>\n<p>No. Height, area, offset, shape and trends help explain causes and risks.<\/p><section class=\"related\"><h2 id=\"related-resources\">Related Resources<\/h2><div class=\"related-grid\"><a href=\"\/solder-paste-printer-guide\/\">Solder Paste Printer Guide<\/a><a href=\"\/aoi-machine-guide\/\">AOI Machine Guide<\/a><a href=\"\/complete-smt-production-line-guide\/\">Complete SMT Production Line Guide<\/a><a href=\"\/contact\/\">Contact SMTBase<\/a><\/div><\/section><section class=\"sources\"><h2 id=\"primary-sources\">Primary Sources<\/h2><ul><li><a href=\"https:\/\/kohyoung.com\/en\/solder-paste-inspection-technology\/\" target=\"_blank\" rel=\"noopener noreferrer\">Koh Young solder paste inspection technology<\/a><\/li><li><a href=\"https:\/\/global.yamaha-motor.com\/business\/smt\/inspectionsystem\/ysi-sp\/feature\/\" target=\"_blank\" rel=\"noopener noreferrer\">Yamaha YSi-SP 3D solder paste inspection<\/a><\/li><li><a href=\"https:\/\/www.juki.co.jp\/en\/products\/smt.html\" target=\"_blank\" rel=\"noopener noreferrer\">JUKI SMT process overview<\/a><\/li><\/ul><\/section><section class=\"cta\"><h2>Need help identifying an SMT replacement part?<\/h2><p>Send the machine model, part number and clear label photos. SMTBase will review the available sourcing options.<\/p><a href=\"\/contact\/\">Contact SMTBase \u2192<\/a><\/section><div class=\"note\">Preview note: technical review is required before publication.<\/div><\/article><\/main><script>(function(){var a=document.querySelector('.article'),r=document.getElementById('reader'),v=r.querySelector('.value'),s=100;function x(){a.style.setProperty('--fs',15*s\/100+'px');a.style.setProperty('--h2',32*s\/100+'px');a.style.setProperty('--h3',22*s\/100+'px');v.textContent=s+'%'}r.onclick=function(e){var b=e.target.closest('button');if(!b)return;if(b.dataset.a==='up')s=Math.min(130,s+5);if(b.dataset.a==='down')s=Math.max(85,s-5);if(b.dataset.a==='reset')s=100;x()};x()})();<\/script><\/div>\n","protected":false},"excerpt":{"rendered":"<p>T\u00ecm hi\u1ec3u c\u00e1c th\u00f4ng s\u1ed1 m\u00e0 c\u00f4ng ngh\u1ec7 SPI 3D \u0111o l\u01b0\u1eddng, c\u00e1ch thi\u1ebft l\u1eadp c\u00e1c ng\u01b0\u1ee1ng ph\u00f9 h\u1ee3p, gi\u1ea3m thi\u1ec3u c\u00e1c c\u1ea3nh b\u00e1o sai v\u00e0 s\u1eed d\u1ee5ng d\u1eef li\u1ec7u v\u1ec1 b\u1ed9t h\u00e0n \u0111\u1ec3 ki\u1ec3m so\u00e1t qu\u00e1 tr\u00ecnh in.<\/p>","protected":false},"author":1,"featured_media":0,"parent":836,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_monsterinsights_skip_tracking":false,"footnotes":""},"class_list":["post-862","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>SPI Machine Guide: Solder Paste Inspection Explained<\/title>\n<meta name=\"description\" content=\"Learn what 3D SPI measures, how to set useful limits, reduce false calls and use solder paste data to control printing.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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