{"id":862,"date":"2026-02-19T09:00:00","date_gmt":"2026-02-19T01:00:00","guid":{"rendered":"https:\/\/smtbase.com\/spi-machine-guide\/"},"modified":"2026-08-23T22:25:39","modified_gmt":"2026-08-23T14:25:39","slug":"spi-machine-guide","status":"publish","type":"page","link":"https:\/\/www.smtbase.com\/es\/recursos\/spi-machine-guide\/","title":{"rendered":"Gu\u00eda de m\u00e1quinas SPI: Explicaci\u00f3n de la inspecci\u00f3n de pasta de soldadura"},"content":{"rendered":"\n<style>\n:root{--navy:#07182e;--blue:#1468e5;--orange:#f47a32;--ink:#17263a;--line:#dfe7f1;--mist:#f4f7fb}*{box-sizing:border-box}html{scroll-behavior:smooth}body{margin:0;color:var(--ink);font-family:Inter,\"Segoe UI\",Arial,sans-serif;line-height:1.72}a{color:var(--blue);text-decoration:none}.shell{width:min(1180px,calc(100% - 40px));margin:auto}.preview{padding:10px;color:#ffe8d8;background:#6e2e0d;text-align:center;font-size:12px;font-weight:700}.hero{padding:92px 0 43px;border-bottom:1px solid var(--line)}.hero .shell{width:min(1180px,calc(100% - 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40px))!important;height:auto!important;margin:34px auto 0!important;overflow:visible!important;border:0!important;border-radius:0!important;background:#eef2f6!important;box-shadow:none!important}\n.smt-article-page .smt-detail-cover img{display:block!important;width:100%!important;height:420px!important;aspect-ratio:auto!important;object-fit:cover!important;object-position:center!important;border:0!important;border-radius:0!important;box-shadow:none!important}\n.smt-article-page .smt-detail-cover figcaption{margin:7px 0 0!important;color:#7b8795!important;background:#fff!important;font-size:10px!important;line-height:1.5!important;text-align:right!important}\n.smt-article-page .smt-detail-cover figcaption a{color:#60758d!important}\n@media(max-width:760px){.smt-article-page .smt-detail-cover{width:calc(100% - 28px)!important;height:auto!important;margin-top:24px!important}.smt-article-page .smt-detail-cover img{height:auto!important;aspect-ratio:3\/2!important}}\n<\/style><div class=\"smt-page-full alignfull smt-article-page\"><header class=\"hero\"><div class=\"shell\"><nav class=\"crumbs\"><a href=\"\/\">Home<\/a><span>\/<\/span><a href=\"\/resources\/\">Resources<\/a><span>\/<\/span><strong>SPI Machine Guide<\/strong><\/nav><h1>SPI Machine Guide: Solder Paste Inspection Explained<\/h1><p class=\"lead\">An SPI machine inspects solder paste after printing and before placement. A 3D system typically measures deposit height, area, volume and offset. Its value is early process control: defects can be found before components and reflow make correction more expensive.<\/p><div class=\"meta\"><span>By SMTBase Editorial Team<\/span><span>Fact checked: 2026-08-23<\/span><span>3 min read<\/span><\/div><div class=\"warning\">Editorial status: technical reviewer name and credentials still need to be added before publication.<\/div><\/div><\/header><figure class=\"smt-detail-cover\"><img fetchpriority=\"high\" src=\"https:\/\/smtbase.com\/wp-content\/uploads\/2026\/08\/resource-cover-spi-machine.webp\" alt=\"Yamaha YSi-SP 3D solder paste inspection machine\" width=\"1200\" height=\"800\" loading=\"eager\" decoding=\"async\"><figcaption>Image source: <a href=\"https:\/\/global.yamaha-motor.com\/business\/smt\/inspectionsystem\/ysi-sp\/\" target=\"_blank\" rel=\"noopener noreferrer\">Yamaha Motor<\/a><\/figcaption><\/figure><aside id=\"reader\"><span class=\"label\">Text size<\/span><button data-a=\"down\">A\u2212<\/button><button class=\"reset\" data-a=\"reset\">Reset<\/button><button data-a=\"up\">A+<\/button><span class=\"value\">100%<\/span><\/aside><main class=\"shell grid\"><aside class=\"toc\"><strong>In this guide<\/strong><nav><a href=\"#measurements-and-meaning\">Measurements and Meaning<\/a><a href=\"#limits-need-process-evidence\">Limits Need Process Evidence<\/a><a href=\"#selection-checklist\">Selection Checklist<\/a><a href=\"#faq\">FAQ<\/a><a href=\"#related-resources\">Related Resources<\/a><a href=\"#primary-sources\">Primary Sources<\/a><\/nav><\/aside><article class=\"article\"><p># SPI Machine Guide: Solder Paste Inspection Explained<\/p>\n<p>An SPI machine inspects solder paste after printing and before placement. A 3D system typically measures deposit height, area, volume and offset. Its value is early process control: defects can be found before components and reflow make correction more expensive.<\/p>\n<h2 id=\"measurements-and-meaning\">Measurements and Meaning<\/h2>\n<div class=\"table-scroll\"><table><thead><tr><th>Measurement<\/th><th>Evidence provided<\/th><\/tr><\/thead><tbody>\n<tr><td>Height<\/td><td>Incomplete or excessive deposit<\/td><\/tr>\n<tr><td>Area<\/td><td>Smear, bridge or poor release<\/td><\/tr>\n<tr><td>Volume<\/td><td>Combined transfer result<\/td><\/tr>\n<tr><td>X\/Y offset<\/td><td>Alignment or board\/stencil variation<\/td><\/tr>\n<tr><td>Shape<\/td><td>Irregular release or contamination<\/td><\/tr>\n<\/tbody><\/table><\/div>\n<p>JUKI describes SPI as measuring area, height, quantity and misalignment with multi-direction lighting and 3D sensing. See <a href=\"https:\/\/www.juki.co.jp\/en\/products\/smt.html\" target=\"_blank\" rel=\"noopener noreferrer\">JUKI process overview<\/a>.<\/p>\n<h2 id=\"limits-need-process-evidence\">Limits Need Process Evidence<\/h2>\n<p>Pad geometry, aperture, paste and package risk affect what is acceptable. Establish a stable print, correlate measurements with post-reflow results, define critical features, review false calls and escapes, and control program changes.<\/p>\n<p>SPI can send corrections or cleaning actions to a printer and offset information to placement on supported lines. JUKI provides examples at <a href=\"https:\/\/www.juki.co.jp\/smt\/en\/automatization\/\" target=\"_blank\" rel=\"noopener noreferrer\">automation solutions<\/a>. Safeguards are required so a bad reference does not cause repeated wrong correction.<\/p>\n<h2 id=\"selection-checklist\">Selection Checklist<\/h2>\n<p>Compare measurable feature size, board range, repeatability, coverage, cycle time, programming, review workflow, traceability, data export and printer\/mounter interfaces. Challenge the system with representative boards and known defects.<\/p>\n<h2 id=\"faq\">FAQ<\/h2>\n<h3 id=\"does-spi-replace-aoi\">Does SPI replace AOI?<\/h3>\n<p>No. SPI evaluates paste before placement; AOI evaluates visible component and solder features later.<\/p>\n<h3 id=\"is-volume-the-only-useful-metric\">Is volume the only useful metric?<\/h3>\n<p>No. Height, area, offset, shape and trends help explain causes and risks.<\/p><section class=\"related\"><h2 id=\"related-resources\">Related Resources<\/h2><div class=\"related-grid\"><a href=\"\/solder-paste-printer-guide\/\">Solder Paste Printer Guide<\/a><a href=\"\/aoi-machine-guide\/\">AOI Machine Guide<\/a><a href=\"\/complete-smt-production-line-guide\/\">Complete SMT Production Line Guide<\/a><a href=\"\/contact\/\">Contact SMTBase<\/a><\/div><\/section><section class=\"sources\"><h2 id=\"primary-sources\">Primary Sources<\/h2><ul><li><a href=\"https:\/\/kohyoung.com\/en\/solder-paste-inspection-technology\/\" target=\"_blank\" rel=\"noopener noreferrer\">Koh Young solder paste inspection technology<\/a><\/li><li><a href=\"https:\/\/global.yamaha-motor.com\/business\/smt\/inspectionsystem\/ysi-sp\/feature\/\" target=\"_blank\" rel=\"noopener noreferrer\">Yamaha YSi-SP 3D solder paste inspection<\/a><\/li><li><a href=\"https:\/\/www.juki.co.jp\/en\/products\/smt.html\" target=\"_blank\" rel=\"noopener noreferrer\">JUKI SMT process overview<\/a><\/li><\/ul><\/section><section class=\"cta\"><h2>Need help identifying an SMT replacement part?<\/h2><p>Send the machine model, part number and clear label photos. SMTBase will review the available sourcing options.<\/p><a href=\"\/contact\/\">Contact SMTBase \u2192<\/a><\/section><div class=\"note\">Preview note: technical review is required before publication.<\/div><\/article><\/main><script>(function(){var a=document.querySelector('.article'),r=document.getElementById('reader'),v=r.querySelector('.value'),s=100;function x(){a.style.setProperty('--fs',15*s\/100+'px');a.style.setProperty('--h2',32*s\/100+'px');a.style.setProperty('--h3',22*s\/100+'px');v.textContent=s+'%'}r.onclick=function(e){var b=e.target.closest('button');if(!b)return;if(b.dataset.a==='up')s=Math.min(130,s+5);if(b.dataset.a==='down')s=Math.max(85,s-5);if(b.dataset.a==='reset')s=100;x()};x()})();<\/script><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Learn what 3D SPI measures, how to set useful limits, reduce false calls and use solder paste data to control 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